Trend of Picosecond Laser Processing

At present, laser processing has been widely used in laser marking, laser drilling, laser cutting and welding, material surface modification, laser rapid prototyping, laser composite processing and so on. In the manufacturing process of smartphone components, laser processing technology can be seen everywhere, such as mobile phone shell cutting, marking, welding, motherboard manufacturing, keyboard chip marking and receiver, earphone, decoration carving and punching, etc.

In the process of marking, optical fiber laser marker is usually used to mark relevant information. Although in many micro-processing applications, we can use nanosecond laser marking machine to achieve, but in the degree of refinement, there are still some shortcomings. The main reason is that using this laser device to mark mobile phones can easily give more heat to mobile phone related fine products, resulting in melting, cracking, changes in surface composition and other harmful side effects.

However, with the current picosecond laser marking machine, it can achieve real non-thermal processing in the fine marking of mobile phones. In the actual marking process, the use of picosecond laser equipment can achieve high-speed, high-quality fine marking on mobile phone-related products, while nanosecond laser equipment is often difficult to achieve the same quality, and easy to produce various defects. Long nanosecond pulses can cause heating of the marker surface, which results in a series of related problems, including edge bulging, melting, debris, cracking or damage of the substrate and so on.

In addition to avoiding heat-related defects, the use of existing picosecond laser equipment can also improve processing efficiency. It takes a long time for other marking devices to process the related parts of mobile phones, which leads to more energy waste, so the heat will lead to melting, and at the same time, it will spread rapidly in the area of processing modification. On the other hand, picosecond laser equipment has a very short interaction time. Almost all of the energy directly acts on the labeled mobile phone parts through laser pulses vertically, realizing instantaneous laser ablation, and has a high processing efficiency.

Lasers are increasingly favored by laser system integrators for their high efficiency and low maintenance operating costs. They have replaced or replaced traditional processing methods in many applications, bringing revolutionary changes to the manufacturing industry and promoting industrial upgrading. With the continuous expansion of laser applications in industrial processing, the laser industry will have the following trends in the next few years:

Pulsed fiber lasers are moving toward high average power and high peak power. In many applications of lasers, such as laser deep-drawing, laser cleaning, etc., pulsed fiber lasers requiring high average power and high peak power, high-beam quality, low-power lasers are used as seed sources, and double-clad fibers are used as amplifiers. Pulsed laser output with high average power and high pulse energy is a hot and difficult point in the current industry research. Continuous fiber lasers are moving toward ultra-high power. Continuous laser is suitable for processing non-metallic materials. It has a wide application space in the field of high-tech materials processing such as semiconductors and composite materials. Under the promotion of high-tech fields such as shipbuilding and aerospace, and the wide application of additive manufacturing technology, higher output power has become One of the main research contents of the development of continuous fiber lasers is that the output power of continuous fiber lasers will develop from the hundred-watt level to the kilowatt level to the megawatt level. Fiber laser output is expected to reach tens of megawatts by using higher power pump sources, more advanced specialty fiber designs, and high power fiber combining technology. Industrial equipment equipped with high-power continuous fiber lasers ranging from kilowatts to tens of thousands of watts will become the mainstream equipment for high-end manufacturing.

Solid-state lasers are moving toward high power and ultra-fast. In the field of laser fine processing, such as brittle material drilling, sapphire glass cutting, etc., higher power, ultra-fast lasers are required. Solid ultrafast lasers are currently a hot spot for research and development. Towards higher brightness. High-power lasers with high beam quality are in high demand in research and military fields, with major users being research institutions, universities and government departments. At present, foreign developed countries regard high-power lasers with high beam quality as the preferred source of tactical laser weapons. Special materials processing, scientific research, military and other special requirements will promote the development of lasers to higher brightness while developing to higher power. Increase output power while maintaining laser output beam quality.

Towards modularization and intelligent development. In order to adapt to the various demands of lasers on the market, lasers will gradually become serialized, combined, standardized and generalized. By combining and matching different modules with limited specifications and varieties, the new product development cycle is shortened and the stability and reliability of the product are improved. At the same time, through the use of advanced communication technology and design concepts, laser remote diagnosis, remote maintenance, remote control and data statistics, through the real-time monitoring of the laser operating state, to detect and deal with potential product failures in advance, thus providing customers with more Good product service.

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